Performance analysis of Multi Walled Carbon Nanotube interconnect for future VLSI applications
نویسنده
چکیده
This paper compares the performance in terms of delay and power of Multi Walled Carbon Nanotubes (MWCNT)based interconnects at 22nm technology node. Similar analysis is carried out for copper based interconnect and results are compared with MWCNT at different interconnect lengths. This analysis shows that due to low resistance and inductance MWCNT bundle interconnect is of lower delay and power than copper interconnect. Results further reveal that the MWCNT gives noticeable improvement in delay for semi global and global length of interconnect.
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